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Platinum Electrode

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Pt Electrodes and
Structured Substrates for
Electronic & piezo-MEMS Devices

Platinum (Pt) thin film is the most widely used bottom electrode for Si-based electronic devices because of its high thermal conductivity and good stability in oxidizing atmospheres. Our high temperature stable platinum wafers guarantee the best performance of electronic devices including MEMS.

Platinized Si wafers

  • Pt film thickness : 50 nm ~ 300 nm
  • Adhesion layer : Ti, 10 nm ~ 20 nm
  • Substrates : SiO2/Si wafers, SiO2/SOI wafers or customers’ preference
  • Size : Sample size ~ 6 inch
  • Orientation : (111)
  • FWHM : ~ 2º (depends on substrate)
  • Temperature endurance : ~ 800℃
  • Roughness(Rms) : ~ 1.5 nm

Metal coating services

  • Pt, Au, Al, Ti, Mo, Ta, Cr, Cu, Ni, NiCr etc.
  • Substrate & Film thickness : customers' preference (need discussion)

Structured Substrates for piezo-MEMS Devices

  • Pt/Ti/SOI wafer
  • Pt/Ti/LTO/Si3N4/(SiO2)/Si wafer
  • Other structured substrates : need discussion

Chemical Coating Solution

The piezoelectric coating solution is for synthesis of the dominant piezoelectric material system used in a vast number of transducers, actuators, and sensors due to its high piezoelectric coupling coefficients and high electromechanical conversion efficiencies

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Chemical Coating Solution

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PZT Sol-gel Solution

  • Lifetime : over 3 months
  • Thickness per one layer : 12 nm - 300 nm (according to molar ratio)
  • Precise composition control Pb and Zr/Ti ratio (within ±2%)
  • Easy dopant addition : La, Ca, Nb, Sr and customers preference
  • Excellent reproducibility
  • Excellent electrical properties

Single Component Chemical Solutions

for dielectric and functional Oxides

  • Materials : Al2O3, TiO2, ZrO2, SiO2, ZnO and customized materials (customers' request)
  • Solution concentration 0.1 - 0.4 mol/L (10 - 100 nm/layer)

Lead-free Sol-gel Solution

KNN or BNKT-based

  • Lifetime : about 3 months
  • Thickness per one layer: 50 nm - 100 nm (according to composition & molar ratio)
  • Precise composition control
  • Excellent reproducibility
  • Excellent electrical properties
  • Non-toxic solvent
  • Good bio-compatibility
  • Easy dopant control
  • CSD process flow will be provided

Multi-Components Chemical Solutions

for dielectric semiconductors, conductors, thermoelectric oxide and functional oxides

  • Materials : BaTiO3, (Ba, Sr)TiO3, ZnO-based multi-components, (La, Ni)CoO3-based p-type, La(Ca, Mn)O3-based n-type, Bi-based pyrochlore and customized materials
  • Solution concentration 0.1 - 0.4 mol/L (10 - 100 nm/layer)
  • Shelf lifetime of solution : 3 months (guaranteed lifetime)
  • Solvent modified 2-methoxyethanol, methanol, ethanol or other alcohol (customers' preference)
  • CSD process flow will be provided
  • Other customized materials available after discussion for detailed specification