Chemical Solution Deposition

PZT- and Lead-free Thin Film Coating Services

Composition : Customers' preference (including dopants)
Target thickness : 100 nm ~ 5 um
Substrate size : Sample size ~ 6 inch
Standard substrate : Pt/Ti/SiO₂/Si, Pt/Ti on SOI wafer or other MEMS structured wafers
Basic data and process flow chart will be provided

Process/Equipment

Process	Equipment	Note
Photolithography	Spin Coater & Track System	Sample ~ 8 inch
	Mask Aligner	Sample ~ 6 inch
	Wet Station & Spin Dryer
	Plasma Asher & Cleaner
Chemical Vapor Deposition	PECVD	Poly Silicon, SiO₂, Si₃N₄
E-beam Lithography	E-beam Evaporator	4 ~ 8 inch / Au, Cu, N, Al, etc
Dry Etcher	DRIE & ICP Etcher	Si, Oxide & Metal film etch
Dry Etcher	Ion Beam Etching System	4 ~ 8 inch
Oxidation	Diffusion Furnace	2 ~ 8 inch
Others	SAM & AAO System
	Dicing Saw
	Electro-plate machine
	Anodic Bonder, Bonding Aligner & Wire Bonder
	Grinding / Polishing Machine