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Film Coating & MEMS Foundry
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Service
Film Coating & MEMS Foundry
Chemical Solution Deposition
PZT- and Lead-free Thin Film Coating Services
Composition : Customers' preference (including dopants)
Target thickness : 100 nm ~ 5 um
Substrate size : Sample size ~ 6 inch
Standard substrate : Pt/Ti/SiO
2
/Si, Pt/Ti on SOI wafer or other MEMS structured wafers
Basic data and process flow chart will be provided
MEMS Foundry
Surface & Bulk Micromachining Process
Process/Equipment
Process
Equipment
Note
Photolithography
Spin Coater & Track System
Sample ~ 8 inch
Mask Aligner
Sample ~ 6 inch
Wet Station & Spin Dryer
Plasma Asher & Cleaner
Chemical VaporDeposition
PECVD
Poly Silicon, SiO
2
, Si
3
N
4
E-beam Lithography
E-beam Evaporator
4 ~ 8 inch / Au, Cu, N, Al, etc
Dry Etcher
DRIE & ICP Etcher
Si, Oxide & Metal film etch
Ion Beam Etching System
4 ~ 8 inch
Oxidation
Diffusion Furnace
2 ~ 8 inch
Others
SAM & AAO System
Dicing Saw
Electro-plate machine
Anodic Bonder, Bonding Aligner & Wire Bonder
Grinding / Polishing Machine